Contact Details
- Email: jin@ochitest.com
- Phone: +86 18921375901
UV Curable Resin
One‑component, fast UV‑curing cold‑mounting resin for heat‑ & pressure‑sensitive samples, clear bubble‑free mounting with low shrinkage.
UV‑Curable Mounting Resin is a single‑component, acrylic‑based cold‑mounting material designed for metallographic sample preparation. It cures rapidly under UV/blue LED light (365–405 nm) without heat or pressure, making it ideal for heat‑sensitive, fragile, tiny, or complex‑shaped samples. It delivers high transparency, low shrinkage, and tight encapsulation for accurate microstructure observation and measurement.
Key Selling Points
- One‑component system: No mixing, no ratio errors, ready to use.
- Ultra‑fast curing: Fully cured in 60–120 seconds, greatly improves lab throughput.
- Low‑temperature curing: Peak temp <70°C, no thermal damage to sensitive materials.
- High transparency & bubble‑free: Clear for direct microscopic observation.
- Low shrinkage & excellent edge retention: Minimizes sample stress and edge chipping during grinding/polishing.
- Good grindability: Consistent surface finish, compatible with standard metallographic preparation workflows.
Technical Parameters
- Type: Single‑component UV‑curable mounting resin
- Base: Acrylic
- Curing light: UV/blue LED 365–405 nm
- Curing time: 60–120 seconds
- Curing temperature: <70°C
- Hardness (Shore D): approx. 83–86
- Transparency: High clear
- Shrinkage: Low (<1%)
- Viscosity: Medium, good flowability
- Packaging: 500g / 1000g bottles
Applicable Materials
Heat‑sensitive metals (Al, Mg, Cu alloys), PCBs, electronic components, semiconductors, plastics, composites, ceramics, coatings, thin films, tiny parts, porous samples, and all materials vulnerable to heat or pressure.
Standard Configuration
- UV‑Curable Mounting Resin (selected volume)
- Safety data sheet (SDS)
- Product instruction sheet
Optional Accessories
- UV/blue LED curing chamber
- Silicone mounting molds
- Disposable mounting molds
- Mold release agent
- Vacuum casting chamber (for porous samples)
Application Cases
- Electronic devices: PCB through‑hole, solder joints, connectors, and micro‑components without thermal damage.
- Light alloys: Aluminum, magnesium, and copper alloys to preserve original microstructure.
- Precision parts: Tiny, fragile, or thin‑wall components requiring perfect edge retention.
- R&D & QC labs: High‑throughput sample preparation for fast inspection and batch testing.
