Contact Details
- Email: jin@ochitest.com
- Phone: +86 18921375901
Diamond Cutting Blade
Diamond Cutting Blade is a high-performance precision cutting disc designed for metallographic sample preparation. It uses high-quality diamond abrasive and high-strength bonding system, ideal for precision sectioning of brittle, hard, heat-sensitive, or valuable materials. It delivers clean, flat cutting surfaces with minimal deformation and heat-affected zone.
Diamond Cutting Blade is a high-performance precision cutting disc designed for metallographic sample preparation. It uses high-quality diamond abrasive and high-strength bonding system, ideal for precision sectioning of brittle, hard, heat-sensitive, or valuable materials. It delivers clean, flat cutting surfaces with minimal deformation and heat-affected zone.
Key Selling Points
- High precision cutting: Narrow kerf reduces material waste and improves utilization.
- Long service life: Stable bonding ensures consistent cutting performance.
- Low heat damage: Minimal thermal impact preserves original material structure.
- Smooth cutting surface: Reduces subsequent grinding and polishing workload.
- Wide compatibility: Fits manual and automatic precision cutting machines.
- Stable cutting: Low vibration, safe operation, high repeatability.
Technical Parameters
- Material: Diamond abrasive + resin bond
- Application: Precision sectioning
- Diameter: 175mm / 250mm / 300mm
- Thickness: 0.5mm
- Inner bore: 32mm
- Package: 1 piece per box
- Suitable hardness: For hard and brittle materials
Applicable Materials
PCB, semiconductor, crystal, integrated circuit, magnetic materials, precision ceramics, optical glass, optical fiber, carbide, ceramic composites, gemstones, and other brittle/valuable materials.
Standard Configuration
- Diamond Cutting Blade ×1 pc
- Protective packaging
- Product instruction
Optional Accessories
- Precision cutting machine
- Cutting coolant / lubricant
- Blade flange set
- Sample fixture
- Cutting fluid filter system
Application Cases
- Electronics & semiconductor: Precision cutting of PCB, wafer, chip, and connector samples.
- Ceramics & optics: Clean cutting of ceramic components and optical glass without chipping.
- Precision instruments: High-accuracy cutting of small, valuable parts.
- Quality control labs: Stable, repeatable cutting for material analysis and testing.
